| 摘要 |
<p>A mounting assembly of an integrated circuit device includes an integrated circuit device (1) having pads (11) on its lower side, through holes (22) formed in a mounting substrate (2) at positions opposed to the pads of the integrated circuit device, and solders (25) for connecting the pads of the integrated circuit device with the through holes. An electrode (24) is provided on the inside wall of each through hole (22), and the mounting substrate (2) includes therein wirings (21) connected to the electrodes. The solder (25) is filled into the through holes to such an extent that the solder filled in the through holes can be visually checked from the lower side of the substrate (2). <IMAGE></p> |
