Method of testing semiconductor devices and conductive adhesive thereby used

摘要

Conductive adhesive for checking electric circuits is formed on contact electrodes (8,9) of a chip package or a multi-chip module. After contact electrodes (8,9) of the chip package or the multi-chip module are set on terminal electrodes (18) of a checking device in a correct position, the chip package or the multi-chip module is mounted on the checking device, so that the contact electrodes (8,9) are electrically connected to the terminal electrodes (18) with the conductive adhesive (17) in-between, and thus the electric circuits of the chip package or the multi-chip module are checked.