| 摘要 |
<p>A solder-bearing lead for attachment to the surface of a substrate, wherein a discrete mass of solder is mechanically held firmly by the lead in a position permitting close proximity to the substrate surface to connect the lead to the substrate with an electrical and mechanical bond upon melting of the solder, the lead body having a pair of fingers partially encircling the solder mass with a gap between the fingers providing an unobstructed flow for the melted solder to the substrate. The lead may also be used to interconnect a first substrate to a second substrate, forming a bond between conductive areas on both substrates. The present application is a continuation-in-part of application Ser. No. 416,505, filed Oct. 3, 1989, U.S. Pat. No. 5,052,954 which is a continuation of application Ser. No. 129,715, now U.S. Pat,. No. 4,883,435, and is also related to U.S. Pat. No. 4,728,305, U.S. Pat. No. 4,679,889, and U.S. Pat. No. 4,605,278. The disclosure of the parent application, Ser. No. 416,505 is incorporated herein by reference.</p> |
