发明名称 Passivation capping layer for ohmic contact in ii-vi semiconductor light transducing device
摘要 A II-VI semiconductor device includes a stack of semiconductor layers. An ohmic contact is provided that electrically couples to the stack. The ohmic contact has an oxidation rate when exposed to an oxidizing substance. A passivation capping layer overlies the ohmic contact and has an oxidation rate that is less than the oxidation rate of the ohmic contact.
申请公布号 AU4643897(A) 申请公布日期 1998.09.09
申请号 AU19970046438 申请日期 1997.06.25
申请人 MINNESOTA MINING AND MANUFACTURING COMPANY 发明人 FEN-REN CHIEN;MICHAEL A HAASE;THOMAS J. MILLER
分类号 H01L31/02;H01L33/28;H01L33/40;H01L33/44;H01S5/028;H01S5/042;H01S5/347 主分类号 H01L31/02
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