EPOXY RESIN COMPOSITION FOR SEALING PHOTOSEMICONDUCTOR DEVICE

摘要

An epoxy resin composition useful as a encapsulating material for photosemiconductor elements such as a photodetector or a light emittor and comprising an epoxy resin, a hardener and at least one compound represented by the following general formula (1) or (2). It can realize an excellent mold releasability from a forming die in transfer molding and the like and also give a encapsulating resin excellent in transparency. wherein Y1 represents -H, -RCOOH, -COR' or -R' wherein R is a bivalent organic group and R' is an alkyl group whose carbon number is not more than 30; x represents a positive number of 8 to 200 and is a mean value; and n is set in such a manner that the weight ratio of the repeating unit n accounts for 25 to 95% by weight based on the whole compound. wherein R represents a bivalent organic group, Y2 represents a metal atom having the valence of one or more, m represents a positive integer corresponding to the valence of Y2, x represents a positive number of 8 to 200 and is a mean value; and n is set in such a manner that the weight ratio of the repeating unit n accounts for 25 to 95% by weight based on the whole compound.