| 摘要 |
Light-receiving devices 2 are two-dimensionally arranged on a substrate 1, bonding pads 4 electrically connected to the light-receiving devices 2 in the respective rows or columns via signal lines 3 are arranged on the outer periphery of the substrate 1, and a protective passivation film 5 is disposed on the light-receiving devices 2 and signal lines 3, thereby forming a light-receiving device array 6. A scintillator 7 made of columnar crystals of Csl is deposited on the light-receiving surface of the light-receiving device array 6, whereas a protective film 11 in which an Al inorganic film 9 is held between organic films 8, 10 made of Parylene is laminated thereon. The outer periphery of the protective film 11 is cut at a position where the bonding pads 4 are exposed, and is brought into close contact with the passivation film 5 with the aid of the coating resin 12. <IMAGE> |
