发明名称 Continuously electroplated foam of improved weight distribution
摘要 A process is disclosed, as well as apparatus useful therefor, for continuously electroplating a strip of reticulated foam using multiple electroplating zones that each contain electroplating bath. In each zone there is a cathode and an anode. In at least one electroplating zone there is an insoluble anode, typically as the sole anode. In some of the electroplating zones soluble anodes may be used. As a first cathode, there can be provided a cathode roll outside of the electroplating bath. The reticulated foam is guided in the bath past the anodes, as well as past cathodes, e.g., including a cathode roll which may be positioned outside of the bath. The resulting electroplated foam emerging from the bath has an improved electroplate weight distribution and the process achieves enhanced efficiencies and economies of operation.
申请公布号 US5804053(A) 申请公布日期 1998.09.08
申请号 US19960738080 申请日期 1996.10.25
申请人 ELTECH SYSTEMS CORPORATION 发明人 VACCARO, ANTHONY J.;GREGG, JANET S.;GIBBONS, DANIEL W.;BRANNAN, JAMES R.;POHTO, GERALD R.;HINDEN, JEAN M.
分类号 C25D5/54;C25D7/06;H01M4/80;(IPC1-7):C25D7/06;C25D17/00 主分类号 C25D5/54
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