Placa de circuito impresso e processo para montagem precisa e solda de componentes eletrónicos na superfície da placa de circuito impresso

摘要

The circuit board (1) is provided with a number of shallow recesses (e.g. 2) each matched to the external contour of the component to be placed in it. These ensure that the components are held in the desired positions after the solder paste has been applied and before the soldering operation is performed. The components may include an overvoltage diverter (4), two varistors (5), and two resistors (6) with positive temperature coefficients. Connection surfaces (7) are arranged at the edges of the recesses, whose inside faces (9) are at least partially metallised.