发明名称 |
Semiconductor device and method for producing a semiconductor device |
摘要 |
A method for producing a semiconductor device includes: a) an attaching process in which a flat-plate member is positioned on a flat-shape lead frame provided with a plurality of leads and a plurality of support bars so that the flat-plate member contacts at least the plurality of leads, and the flat-plate member is attached to plurality of support bars; b) an element mounting process in which a semiconductor element is mounted on the flat-plate member attached to the plurality of support bars of the flat-shape lead frame; c) a wire-bonding process in which a wire is provided between each of the plurality of leads and the semiconductor element; and d) a separating process, performed after the completion of the wire-bonding process, in which the plurality of support bars are deformed so as to separate the flat-plate member and the plurality of leads and electrically disconnect or separate the flat-plate member from the plurality of leads.
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申请公布号 |
US5804469(A) |
申请公布日期 |
1998.09.08 |
申请号 |
US19970839796 |
申请日期 |
1997.04.18 |
申请人 |
FUJITSU LIMITED |
发明人 |
ASANO, YUICHI;KOBAYASHI, HITOSHI;WAKO, KATSUNORI |
分类号 |
H01L23/50;H01L23/433;H01L23/495;(IPC1-7):H01L21/44 |
主分类号 |
H01L23/50 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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