发明名称 Photolithography masks including phase-shifting layers and related methods and structures
摘要 A phase-shifting mask is provided for irradiating a microelectronic wafer having first and second wafer regions wherein the first wafer region has a large step difference relative to the second wafer region. The phase-shifting mask includes a substrate which transmits light therethrough and a patterned layer of a phase shifting material which shifts a phase of light transmitted by the substrate. The phase-shifting mask also includes a layer which controls the transmissivity of light through the phase-shifting mask so that a transmissivity of light through a first mask region is small relative to a transmissivity of light through a second mask region wherein the first mask region corresponds to the first wafer region and the second mask region corresponds to the second wafer region. Related masks and structures are also discussed.
申请公布号 US5804338(A) 申请公布日期 1998.09.08
申请号 US19960742247 申请日期 1996.10.31
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 LIM, SUNG-CHUL;MOON, SEONG-YONG
分类号 G03F7/11;G03F1/00;G03F1/08;G03F1/14;H01L21/027;(IPC1-7):G03F9/00 主分类号 G03F7/11
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