发明名称 |
Curable organosiloxane compositions and semiconductor devices |
摘要 |
A curable organosiloxane composition useable as a silicone die attach adhesive, an electrically conductive silicone rubber composition each comprising a composition that cures through both addition and condensation reactions, that will not impair wire bondability to a semiconductor chip or lead frame after the semiconductor chip has been bonded to a substrate or package; and semiconductor devices in which the semiconductor chip is bonded to its substrate or package using the curable organosiloxane composition and in which the semiconductor device that evidences high reliability by virtue of the use of the curable organosiloxane composition. |
申请公布号 |
US5804631(A) |
申请公布日期 |
1998.09.08 |
申请号 |
US19960688456 |
申请日期 |
1996.07.30 |
申请人 |
DOW CORNING TORAY SILICONE CO., LTD. |
发明人 |
MINE, KATSUTOSHI;MITANI, OSAMU;NAKAYOSHI, KAZUMI;TAZAWA, RIKAKO |
分类号 |
C08K3/08;C08L83/04;C09J183/04;H01L21/58;H01L23/495;(IPC1-7):C08K3/08 |
主分类号 |
C08K3/08 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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