发明名称 |
Electronic circuit bonding interconnect component and flip chip interconnect bond |
摘要 |
An inexpensive low contact resistance electrical bonding interconnect having a metal bond pad portion and conductive epoxy portion. The conductive epoxy portion comprises a metal oxide reducing agent for reducing oxides formed before and/or during the fabrication of the bonding interconnect. The bonding interconnect is used to bond a die pad to a supporting substrate thereby forming a surface mount device. |
申请公布号 |
US5804876(A) |
申请公布日期 |
1998.09.08 |
申请号 |
US19970853852 |
申请日期 |
1997.05.09 |
申请人 |
MICRON COMMUNICATIONS INC. |
发明人 |
LAKE, RICKIE C.;TUTTLE, MARK E. |
分类号 |
H01L21/60;H01L23/485;H05K3/32;(IPC1-7):H01L23/48 |
主分类号 |
H01L21/60 |
代理机构 |
|
代理人 |
|
主权项 |
|
地址 |
|