| 摘要 |
PROBLEM TO BE SOLVED: To eliminate warp of package due to thermal stress even when the coefficient of thermal expansion of chip is different from that of resin-based wiring board, and to prevent any crack of resin at the time when water content of filled resin between the chip and board evaporates due to heat, in a single side resin packaging type package. SOLUTION: This semiconductor device is provided with a wiring board 21 having grooves 20 which are connected to the outside ends at such a position as to avoid a wiring pattern 13 including a part to be connected and a wiring pattern on a chip mount surface, a semiconductor chip 10 in which an element formation surface having a group of outer connection terminals 12 is mounted facedown on the surface of wiring board and the group is connected with the part to be connected, a resin 16 which is packaged to fill between the chip and the board and to cover the respective outer pheriphery side faces of chip, and terminals 22 for outer connection which are formed on the non-mount surface of chip of the board and are connected electrically with the wiring pattern, and the inner surfaces of the grooves are coated with a peeling agent 20a for resin.
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