TRANSPORT METHOD OF SEMICONDUCTOR DEVICE, SEMICONDUCTOR DEVICE AND TRAY

摘要

PROBLEM TO BE SOLVED: To provide a semiconductor device and a tray thereof with a wide usability by which the transport cost is reduced and lead cables are not deformed during transport of the tray. SOLUTION: One or more semiconducor devices 6 are transported after these devices have been put on a tray 1. An engaging part of the semiconducor device side (curb-shaped recessed pattern) 10 is formed at the underface of the device and also an engaging part of the tray side (curb-shaped projection pattern) 5 with which the engaging part 10 of the semiconductor device side can be fitted is formed at the mounting part of the semiconductor device on the tray 1. After the semiconductor device 6 has been contained so as to engage the engaging part of the semiconductor device side with the engaging part 5 of the tray side, the tray is transported. The distance between adjacent engaging parts of the trays is designed so as to contain the semiconductor devices having a specified range of outside dimensions without mutual hindrance.