| 摘要 |
PROBLEM TO BE SOLVED: To prevent the burr production, by a method wherein inner lead and outer lead as well as a conductive wire connected to a pad of a semiconductor chip and the inner lead are inserted into the cavity of a lower metallic mold, while a roll back tape and an upper metallic mold are formed by adhesion.clamping and, after curing, the rolled back tape is removed. SOLUTION: An inner lead 3a and an outer lead 3b bonded onto both sides of the top face of a semiconductor chip 1 as well as a conductive wire 4 between the inner lead 3b and the semiconductor chip 1 are respectively inserted into respective forming cavities 10 of a lower metallic mold 8, and then a rolling back tape 11 and an upper metallic mold 9 are successively positioned above the lower metallic mold 8. In such a constitution, the burr production on the top face of the outer lead 3b can be avoided or removed by using intensively heat-resistant tape having adhesive member in contact with the outer lead 3b or intensively heat-resistant tape having no adhesive member in contact with the outer lead 3b, thereby enabling a reel to be positioned on both sides of the metallic mold for the tape to be fed and rolled back per forming cycle. |
