| 摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method for a liquid ejection recording head capable of accurately performing reliable electric bonding in low cost an of increasing yield of products in ILB of a chip for a liquid ejection recording head having a penetrating ink supplying hole on a central section thereof. SOLUTION: An electrode pad 23 of a chip 20 for a liquid ejection recording head in which an ink supplying hole and an ejection energy conversion element for ejecting ink are formed at a central section thereof and an inner lead 40 on a TAB tape 41 for supplying an electric power are bonded by ILB to each other by using a single point bonding tool of which tip portion has a groove structure consisting of two grooves crossed perpendicular to each other. As a result, it is unnecessary to enhance an attracting force for fixing the chip 20 to a chip stage and a dust or the like is not attached thereto. It is possible to achieve adequate, accurate and reliable electric bonding. |
