| 摘要 |
PROBLEM TO BE SOLVED: To prevent a developer from reaching the rear side of a substrate and to make a developer layer always uniform in thickness by disposing a developer controlling plate whose flat face is brought into contact with the upper peripheral edge of the developer layer to allow the excess developer to flow backward along the flat face. SOLUTION: A developer controlling plate 1 is disposed near the periphery of a wafer 13 as a substrate at a prescribed interval so that the flat face 4 makes an angle with the surface of the wafer 13. A developer is dropped on the wafer 13 under rotation to form a developer layer 15 and the flat face 4 is brought into contact with the upper peripheral edge of the layer 15 to allow the excess developer to flow backward along the face 4. |
