Semiconductor device and semiconductor multi-chip module

摘要

A semiconductor device (36) includes a flexible substrate (38) having a plurality of metal conductors (40) on two opposing sides. A pair of thermally conductive extensions (44) is an integral part of the flexible substrate, and a semiconductor die (46) can be directly mounted thereon. Multiple devices can be stacked to form a multichip module (50), in a carrier socket (56).