发明名称 MODULAR JACK ASSEMBLY
摘要 PROBLEM TO BE SOLVED: To provide a metal shield for a modular jack which makes a large number of contacts of a grounding low inductance path and a front panel possible. SOLUTION: A metal shield is equipped with first shield member 40 which is arranged so as to be superimposed on the top wall portion 14 and the side wall portion of an insulation housing, and second shield member 74. The second shield member 70 surrounds the front opening end portion of the insulation housing, first tab 82 of the second member 70 is engaged with the hole 64 of the first member. Second tab 26 of the second member 70 is bent backward and upward, and thereafter backward and downward so as to be brought into contact with the first member 40. Third tab 94 of the second member is bent backward and upward so as to engage with a plane 106.
申请公布号 JPH10233252(A) 申请公布日期 1998.09.02
申请号 JP19970206490 申请日期 1997.07.31
申请人 BERG TECHNOL INC 发明人 BELOPOLSKY YAKOV;CURWEN PETER D
分类号 H01R13/33;H01R13/648;H01R13/658;H01R13/74;(IPC1-7):H01R13/33 主分类号 H01R13/33
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