发明名称 PROCESSING DEVICE
摘要 <p>PROBLEM TO BE SOLVED: To provide a holding jig wherein a plurality of to-be-held objects are held horizontally while away from each other in vertical direction and the entire surface is washed with sure. SOLUTION: A holding jig 40 which holds two wafers 4 horizontally in a process chamber comprises a main body 41 placed on the floor of process chamber, four supporting pins 45 of such shape with the step protruding vertically above the upper surface of main body, and two holding plates 53 and 53a which hold the wafer 4 while kept away from each other in vertical direction with supporting pins, supported detachably. Each holding plate comprises a plurality of to-be-supported holes 60 and 60A which, with a supporting pin inserted, is engaged from under side, a through hole 54 whose diameter is larger than the outside diameter of the wafer 4, and a plurality of engagement claws 55 which, protruding to inside periphery of the through hole toward the center in radius direction, engage with the outside periphery part from under side. By holding the wafer 4 one by one with each holding plate, the holding jig can hold two wafers apart horizontally. By disassembling each holding plate out of the main body and submerging it in etching liquid, each holding plate and main body are washed to a minute part.</p>
申请公布号 JPH10233432(A) 申请公布日期 1998.09.02
申请号 JP19970052399 申请日期 1997.02.20
申请人 HITACHI LTD 发明人 OKAWA AKIRA
分类号 H01L21/683;H01L21/205;H01L21/68;(IPC1-7):H01L21/68 主分类号 H01L21/683
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