发明名称 Heat dissipating assembly
摘要 <p>Highly efficient heat sink assemblies are formed using a thermally conductive body (10) by positioning a fan (14) in a cavity (12) intermediate the ends of the body which defines a plurality of channels (22). Air is forced through the channels by the fan to cool the opposed surfaces of the heat sink body. <IMAGE></p>
申请公布号 EP0862210(A2) 申请公布日期 1998.09.02
申请号 EP19980300721 申请日期 1998.02.02
申请人 THERMALLOY INCORPORATED 发明人 EDWARDS, STEVEN F.;JORDAN, WILLIAM D.
分类号 H01L23/36;H01L23/467;(IPC1-7):H01L23/467 主分类号 H01L23/36
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