发明名称 |
DEVICE AND METHOD FOR MEASURING IN-LINE THICKNESS OF DIELECTRIC LAYER |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a device and a method for detecting and monitoring the thickness of a dielectric substance with accuracy and high efficiency at polishing sequence of a mechanochemical flattening process. SOLUTION: After a dielectric layer is polished with a mechanochemical polisher with polishing slurry, a device which measures in-line thickness of the dielectric layer on the surface of a work piece is released. The device for measuring in-line thickness is provided with a measuring platen 102 and a measuring electrode buried in the measuring platen. A means 120 which detects system capacitance C with an RC equivalent circuit is provided. A means 122 which converts the detected capacitance into thickness of a dielectric substance by means of correction to a specified system capacitance/optical thickness is provided. This specified correction corresponds to a BEOL(back end of line) structure at a level provided with the work piece.</p> |
申请公布号 |
JPH10233421(A) |
申请公布日期 |
1998.09.02 |
申请号 |
JP19980013065 |
申请日期 |
1998.01.26 |
申请人 |
INTERNATL BUSINESS MACH CORP <IBM> |
发明人 |
NAPHTALI E LASTIG;WILLIAM L GUTHRIE;THOMAS E SANDWICK |
分类号 |
G01B7/06;B24B37/013;B24B49/04;G01N27/22;H01L21/304;H01L21/3105;H01L21/66;(IPC1-7):H01L21/66 |
主分类号 |
G01B7/06 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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