摘要 |
PROBLEM TO BE SOLVED: To reduce a loss, to make the upper surface of a clad layer smooth, to improve dimension accuracy, to make a substrate thin and to simplify the manufacturing process. SOLUTION: A buffer layer 102 is formed on the surface of the substrate 101, and a core layer 103 and a flank clad layer 104 are formed flat on the surface thereof. Both use PMMA(poly methyl methacrylate), in which DMAPN is dispersed as a material, and a formation region alone of the flank clad layer 104 except for a formation part of the core layer 103 is irradiated with light energy so that signal light is transmitted through only the PMMA layer, in which DMAPN is dispersed, to evaporate the DMAPN. The upper surfaces of the core layer 103 and the flank clad layer 104 are provided with the upper clad layer 105. |