| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a semiconductor device which is formed in almost the same size as a chip using an ordinary chip and is flexible as well. SOLUTION: A semiconductor device 10 is provided with an interposer 13 adhered to a chip 11, and the interposer 13 is made smaller than the chip 11, and then a step is provided between the bonding pad 16 of the interposer 13 and an electrode 14, and the bonding pad 16 of the interposer 13 and the bonding pad 12 of the chip 11 are connected with a wire 17.</p> |
