| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide an ultraviolet radiating apparatus which can minimize the size of an ultraviolet radiating mean and can suppress excessive ultraviolet radiation at its rotation center to avoid local heating and an adverse thermal influence on adhesive tape. SOLUTION: An apparatus is used when it is desired to reduce the adhesive force of adhesive tape of an ultraviolet curing type applied on an article such as a semiconductor wafer by radiating ultraviolet rays on the tape. In this case, an ultraviolet radiating lamp 8 is positioned above a rotary base 3 rotatably carrying thereon a semiconductor wafer W having an adhesive tape T applied thereto, at such an attitude as tilted to a rotary surface S of the semiconductor wafer W, so that, as it goes toward a rotation center P, a distance therefrom to the wafer W becomes larger.</p> |
