| 摘要 |
<p>PROBLEM TO BE SOLVED: To eliminate corrosion of a wiring due to a crack in a chip and to provide a solid-state image pick-up device, which has no image defect and has a one-dimensional or two-dimensional array of connection parts, by a method wherein the chlorine content of an organic material, which is filled in the connection parts between substrate, is set at a specified value or lower. SOLUTION: Sensor substrates 310 to 313 are sliced (310) using a diamond blade 314. Then, circuit boards 101 are respectively mounted (302) to draw out electrodes 110 of the substrates 310 to 313 via flexible substrates 102 by a bonding means 315. Then, sealing materials 111 are respectively applied (303) on the electrodes 110 by a dispenser 316. Then, the substrates 310 to 313 are aligned (304) with each other. Then, an organic resin 112 is applied on a base 108 at a position where a bonding agent 109 for sensor substrate fixing and the connection parts between the sensor substrates come into contact with the base 108. The substrates 310 to 313 are placed on the base 108 and are fixed on the base 108. The chlorine content of the bonding agent 112 is 200ppm or less.</p> |
