WRAPPING VESSEL FOR SEMICONDUCTOR WAFER

摘要

PROBLEM TO BE SOLVED: To provide a vessel main body comprising a new structure for a semiconductor wafer wrapping vessel wherein defects of conventional vertical and horizontal types are eliminated while their merits are maintained. SOLUTION: Upper and lower split vessels 11 and 12 are so manufactured as a vessel main body is divided into one split top plate part and split bottom plate part, wherein the top plate part and bottom plate part face each other on diagonal line with a semiconductor wafer placed horizontally, are less that 1/2 in area, while a periphery part 13 is so divided as each of split top plate part and split bottom plate part which face each other in vertical direction is assigned to left and right. With this structure, a wafer carrier 30 is detached/ attached to a vessel main body with a simple operation in any of vertical or horizontal state.