| 摘要 |
PROBLEM TO BE SOLVED: To execute efficiently the manufacturing work of a semiconductor package to normal printed circuit board units, by a method wherein through holes for 'detect' indication are bored in a defective unit, without using a paint of a decision indication to the defective unit of the printed circuit board units constituting a printed circuit board strip for ball grid array semiconductor package. SOLUTION: A short-circuit between conductive traces 13 formed by patterning very microscopically on individual printed circuit board units 11, which constitute a completed printed circuit board strip 10 for ball grid array semiconductor package, a defect from the viewpoint of the general view of the conductive traces 13 and the like are inspected and in a unit 11' decided that the unit 11' is 'defective', at least more than one of defect indication through holes 17 are buried within a region between the outer peripheral edge of a resin sealing part molding region 15 of the unit 11' and a cutting line 16. Thereby, as the defective unit 11' with the through holes 17 for defect indication bored is easily identified and can be skipped, the mounting of a high-cost semiconductor chip in a semiconductor chip mounting stage can be easily avoided and the effectiveness and economical efficiency of the production process of a semiconductor package are raised. |
