| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device of high reliability which maintains electrical connection even when pressure welding condition between each electrode is damaged by causing a crack in the resin which bonds a semiconductor pellet and a wiring board, and maintains the pressure welding condition between each electrode, by pressure-welding a bump electrode and a pad electrode for electrical connection, and making recessed and protruding parts formed on each electrode engage with each other. SOLUTION: A semiconductor pellet 9 on which a plurality of bump electrodes 12 are formed is made to face a wiring board 13 on which pad electrodes 15 are formed corresponding to the bump electrodes 12, the bump electrode 12 and the pad electrode 15 are overlapped each other and pressurized, and a facing portion between the facing surfaces of the semiconductor pellet 9 and the wiring board 13 is bonded with a resin 16. In this way, a semiconductor device of flip chip structure is constituted. In this device, on the overlapping parts of the bump electrode 12 and the pad electrode 15, a protruding part 12b and a recessed part 15a which have diameters smaller than the bump electrode 12 and engage with each other are formed, respectively. |
