发明名称 DEVICE FOR PASTING ADHESIVE TAPE TO SUBSTRATE
摘要 <p>PROBLEM TO BE SOLVED: To allow a substrate to be pasted on the adhesive tape of a ring frame with precision while the substrate is handled in a normal posture. SOLUTION: A substrate holding part 1 which holds a substrate W with its rear side downward, a ring frame 3 to which an adhesive tape 2 is pasted, a ring frame holding part 4 which holds the adhesive tape 2 with its adhesive surface upward, a thin-wall elastic member 14 which is, of almost identical shape with the substrate W, provided under the ring frame holding part 4, and a pasting roller 20 which moves, for scanning, along the under side of the ring frame holding part 4 are provided. The adhesive tape 2 is pressed to the rear surface of substrate W through the elastic member 14, along scanning movement of the pasting roller 20.</p>
申请公布号 JPH10233429(A) 申请公布日期 1998.09.02
申请号 JP19970034714 申请日期 1997.02.19
申请人 NITTO DENKO CORP 发明人 MATSUSHITA TAKAO;KURODA SHIGEHISA
分类号 C09J5/00;H01L21/68;H01L21/683;(IPC1-7):H01L21/68 主分类号 C09J5/00
代理机构 代理人
主权项
地址