| 摘要 |
A method and apparatus for conductively cooling daughter card assemblies mounted to either an air or liquid cooled computer circuit module wherein the module has a cold plate and at least one mother board adjacent the cold plate. The module carries a number of daughter assemblies thereon adjacent the mother board. Each daughter card assembly has at least one daughter board which carries a number of electronic components on an element side of the board. A cooling side is disposed opposite the element side on the board. A thermally conductive plate has an inner side facing the mother board and an outer side opposite the inner side. The inner side has one or more projecting members extending perpendicularly towards the mother board. The daughter board is parallel to and in conductive contact with one side of the conductive plate. The module cold plate has a number of upstanding spacers projecting toward the mother board. A portion of the top of each spacer is exposed for receiving thereon one of the projecting members of the conductive plate in intimate conductive contact. Preferably, the conductive plate is sandwiched between the cooling sides of a pair of daughter boards. Heat generated by the electronic components on the daughter boards is transferred by conduction through the boards into the conductive plate. The heat conducts through the projecting members into the spacers and into the module cold plate. The heat is then carried away by the cooling medium flowing through the cold plate.
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