| 摘要 |
A method of manufacturing a connecting structure of first and second printed wiring boards each having an electrode for conductively connecting to each other using a conductive film. A first printed wiring board with a resist film bonds to a second printed wiring board directly or using conductive film or bonding film. Both electrodes can be bonded using a conductive film and/or a bonding film. The resist film on one printed wiring board can be bonded to the electrode of another printed wiring board using a conductive film, or both resist films can be bonded using a conductive film.
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