发明名称 |
Copper alloy mold for casting aluminum or aluminum alloy |
摘要 |
A mold for casting aluminum or aluminum alloy made of a copper alloy having a thermal conductivity of not less than 0.20 cal/s.cm DEG C. The mold cavity surface is locally or entirely formed with a coated layer. The coated layer may be either (i) a cermet layer including of at least one element selected from the group consisting of Co, Cu, Cr and Ni, or (ii) a Co-, Ni-, Cr -or Mo-based hard alloy layer. The copper alloy mold exhibits distinguished thermal conductivity and resistance to melt damages.
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申请公布号 |
US5799717(A) |
申请公布日期 |
1998.09.01 |
申请号 |
US19960751100 |
申请日期 |
1996.11.15 |
申请人 |
TECHNO COAT COMPANY, LTD.;NGK INSULATORS, LTD. |
发明人 |
AOSHIMA, SHOJU;MURAMATSU, NAOKUNI |
分类号 |
B22C3/00;B22C9/06;B22D17/22;C22C9/06;C23C2/06;C23C30/00;(IPC1-7):B28B7/36 |
主分类号 |
B22C3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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