发明名称 |
Structure and fabrication of semiconductor device having merged resistive/capacitive plate and/or surface layer that provides ESD protection |
摘要 |
A compact RC semiconductor structure suitable for integrated RC and RCD networks contains a semiconductor body (10), an overlying dielectric layer (14), and a resistive plate (16A) situated over the dielectric layer. The resistive plate constitutes both a resistor and at least part of the upper plate of a capacitor whose lower plate (12) is formed with part of the semiconductor body below the dielectric layer. A capacitive structure which provides high ESD protection is formed with a semiconductor body (10) that contains a heavily doped surface layer (12) whose sheet resistance is no more than 5 ohms/square. The surface layer constitutes the lower plate for a capacitor whose upper plate is formed with a conductive plate (16A) situated on a dielectric layer (14) overlying the semiconductor body.
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申请公布号 |
US5801065(A) |
申请公布日期 |
1998.09.01 |
申请号 |
US19960609414 |
申请日期 |
1996.03.01 |
申请人 |
UNIVERSAL SEMICONDUCTOR, INC. |
发明人 |
RIZVI, WAJID H.;DENDULURI, MURALI K.;ANZELC, GREG;FONG, HENRY P. Y.;SHINKRE, RAHUL B.;HO, DANIEL Q. |
分类号 |
H01L21/02;H01L27/06;(IPC1-7):H01L21/70 |
主分类号 |
H01L21/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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