发明名称 Contact with a silver contact base and process for making the same
摘要 A contact includes a silver contact base, an intermediate silver layer and a solder in the form of a platelet being provisionally fastened or tacked to the intermediate silver layer prior to an actual soldering operation. The silver contact base is soldered onto a contact carrier by the intermediate silver layer and the solder platelet. A method for making a contact includes pressing an intermediate silver layer onto a silver contact base, then provisionally fastening or tacking a solder in the form of a platelet to the intermediate silver layer and subsequently placing a contact carrier on the solder platelet and soldering the contact carrier to the solder platelet.
申请公布号 US5799771(A) 申请公布日期 1998.09.01
申请号 US19960745502 申请日期 1996.11.12
申请人 SIEMENS AKTIENGESELLSCHAFT 发明人 SCHNEIDER, MANFRED;CLAUSS, DIETMAR
分类号 H01H1/023;H01H11/04;H01H11/06;(IPC1-7):H01H1/02 主分类号 H01H1/023
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