发明名称 |
Contact with a silver contact base and process for making the same |
摘要 |
A contact includes a silver contact base, an intermediate silver layer and a solder in the form of a platelet being provisionally fastened or tacked to the intermediate silver layer prior to an actual soldering operation. The silver contact base is soldered onto a contact carrier by the intermediate silver layer and the solder platelet. A method for making a contact includes pressing an intermediate silver layer onto a silver contact base, then provisionally fastening or tacking a solder in the form of a platelet to the intermediate silver layer and subsequently placing a contact carrier on the solder platelet and soldering the contact carrier to the solder platelet.
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申请公布号 |
US5799771(A) |
申请公布日期 |
1998.09.01 |
申请号 |
US19960745502 |
申请日期 |
1996.11.12 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
SCHNEIDER, MANFRED;CLAUSS, DIETMAR |
分类号 |
H01H1/023;H01H11/04;H01H11/06;(IPC1-7):H01H1/02 |
主分类号 |
H01H1/023 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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