Process for fabricating flex circuits and product thereby

摘要

A process (200) for fabricating a flex circuit (708, 806, 812, 818 or 824) using a fabrication process without the use of a photomask includes the steps of generating (412) an electronic image (702 or 802) of circuit traces (704 or 804) representing at least a single-sided flex circuit, and selectively thermal transferring (506 or 606) a resin to either a conductively clad or non-conductive flexible substrate (304) under the control of the electronic image (702 or 802) to form either an etch resist or a conductor which defines the circuit traces (704 or 804). The conductively clad flexible substrate (304) is etched to form the circuit traces (704 or 804) of the flex circuit defined by the etch resist, after which the etch resist is removed.