Process and substrate for connecting an integrated circuit to another substrate by means of balls

摘要

PCT No. PCT/FR95/01670 Sec. 371 Date Jun. 19, 1996 Sec. 102(e) Date Jun. 19, 1996 PCT Filed Dec. 14, 1995 PCT Pub. No. WO96/19013 PCT Pub. Date Jun. 20, 1996An integrated circuit (IC) package (10), having an integrated circuit (11) and a connecting substrate (12) comprising an insulating film (13), one side of which carries conductors (14) and the other side of which carries balls (15) connected to the respective conductors by means of via holes (16) in the film. The balls (15) are fixed directly to said via holes, the base of which is formed by the respective conductors. The balls are preferably made of a remeltable material such as tin lead and the fixation can be made initially by an adhesive substance. The process for connecting two connecting substrates (12, 22) by means of balls (15), one of which substrates comprises a film (13), one side of which is provided with conductors (14) and the other side of which is provided with via holes (16), consists of fixing the balls directly to the conductors in the via holes by remelting the balls. The balls can be soldered or prefixed by an adhesive substance to connecting pads (23) of a board (22).