发明名称 SYSTEM AND METHOD OF PRODUCTION OF PRINTED CIRCUIT BOARD ASSEMBLIES.
摘要 A method for producing a printed circuit board assembly; which is implemented in a system having a computer for storing the instruction diagrams of the insertion of the parts and exhibiting the instructions of the insertion of the parts, and a welder unit for welding a printed circuit board, including the steps of: mounting different types of printed circuit boards from pieces of parts and inspecting them in a multitude of cells; installing different types of carrier printed circuit boards for mounting them in a separated manner according to the insertion instructions of the exhibited parts by the computer of each cell, and moving them to the welder unit through a transference transporter line; and returning the transporters having the completed welded printed circuit boards to each identified cell by the carriers through a line of the returning transporter.
申请公布号 MX9709038(A) 申请公布日期 1998.08.30
申请号 MX19970009038 申请日期 1997.11.24
申请人 SAMSUNG ELECTRONICS CO. LTD. 发明人 EON-MIN SHIN;KYU-DONG LEE;TAE-HA KIM;DOO-WON KANG;BUM-SUCK KIM;YANG-KOOG KIM;SEONG-DEOK LEE
分类号 B23P19/00;B23P21/00;H01L21/00;H05K3/00;H05K3/34;H05K13/00;(IPC1-7):H05K13/00 主分类号 B23P19/00
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