发明名称 |
SYSTEM AND METHOD OF PRODUCTION OF PRINTED CIRCUIT BOARD ASSEMBLIES. |
摘要 |
A method for producing a printed circuit board assembly; which is implemented in a system having a computer for storing the instruction diagrams of the insertion of the parts and exhibiting the instructions of the insertion of the parts, and a welder unit for welding a printed circuit board, including the steps of: mounting different types of printed circuit boards from pieces of parts and inspecting them in a multitude of cells; installing different types of carrier printed circuit boards for mounting them in a separated manner according to the insertion instructions of the exhibited parts by the computer of each cell, and moving them to the welder unit through a transference transporter line; and returning the transporters having the completed welded printed circuit boards to each identified cell by the carriers through a line of the returning transporter. |
申请公布号 |
MX9709038(A) |
申请公布日期 |
1998.08.30 |
申请号 |
MX19970009038 |
申请日期 |
1997.11.24 |
申请人 |
SAMSUNG ELECTRONICS CO. LTD. |
发明人 |
EON-MIN SHIN;KYU-DONG LEE;TAE-HA KIM;DOO-WON KANG;BUM-SUCK KIM;YANG-KOOG KIM;SEONG-DEOK LEE |
分类号 |
B23P19/00;B23P21/00;H01L21/00;H05K3/00;H05K3/34;H05K13/00;(IPC1-7):H05K13/00 |
主分类号 |
B23P19/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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