SURFACE MOUNT TO-220 PACKAGE AND PROCESS FOR THE MANUFACTURE THEREOF.

摘要

The present invention provides for a surface mount TO-220 package in which the leads are bent prior to molding the resin body around the device and frame to minimize the mechanical stress on the leads. Also, a single gauge of lead frame material is used which minimizes material costs and reduces the height of the package body. The length of the leads is also greatly shortened and minimizes the built-in resistance and inductance of the package. The short lead frame also improves assembly yield. The package is suitable to be a drop-in replacement of existing surface mount design TO-220 type packages but can accept larger die sizes than existing size 4 die.