发明名称 METHOD OF SCANNING SEMICONDUCTOR WAFERS TO INSPECT FOR DEFECTS
摘要 A patterned semiconductor wafer (60) is centered on a vacuum chuck (20) that is capable of being rapidly rotated about an axis normal to the wafer (60) surface. The vacuum holds the wafer (60) flat to the chuck (20). As the chuck (20) is rotated, the wafer (60) rotates and the surface of the wafer (60) is scanned (10) with an optical head (30). The output is fed through a signal line (47) of the read head (30) and is compared to a reference file in a processor (50) or signal representing what a perfectly pattern wafer should look like. Differences between the reference standard and the patterned wafer (60) indicate flaws in the patterning. In the case of an unpatterned surface such as a wafer, glass substrate for a liquid crystal display, or a magnetic memory, the reference signal is a null signal and any signal from the read head (30) would signify a flaw in the unpatterned surface.
申请公布号 WO9837404(A1) 申请公布日期 1998.08.27
申请号 WO1998US03239 申请日期 1998.02.20
申请人 BRAGINSKY, SIDNEY;PARKS, ROBERT 发明人 BRAGINSKY, SIDNEY;PARKS, ROBERT
分类号 G01B11/30;G01N21/95;G01N21/956;H01L21/66;(IPC1-7):G01N21/00;G01N21/84;G01N21/86;G01B9/08;G01B11/00 主分类号 G01B11/30
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