发明名称 HIGH SPEED JET SOLDERING SYSTEM
摘要 <p>Continuous jetting of liquid metal droplets for deposit on a substrate includes an ejector, a deflection device, a print chute, and a collection reservoir. Liquid metal from a cartridge in the ejector provides a continuous molten material stream through an orifice-defining structure while a vibration device creates a standing wave in the stream to break the molten material stream into individual droplets which receive charge from a charging device. The deflection device enables the positioning of the charged droplets to be controlled for placement on a substrate. Control systems assist in the calibration and control of the continuous stream to ensure that selected droplets are placed at desired locations on the substrate.</p>
申请公布号 WO1998036864(A2) 申请公布日期 1998.08.27
申请号 US1998002519 申请日期 1998.02.09
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