摘要 |
A resin-sealed semiconductor device, including a chip mounting die pad, porous fluorocarbon material located just beneath the die pad, beneath a die-pad supporting layer, gold lead wires, or in a sealing resin surrounding the other components, wherein any water vapor generated by the heat of soldering will be held within the porous fluorocarbon rather than crack the sealant under internal pressure. <IMAGE> |
申请人 |
JAPAN GORE-TEX, INC., TOKIO/TOKYO, JP |
发明人 |
HAZAKI, YOSHITO, OKAYAMA-SHI, OKAYAMA-KEN 703, JP;HATAKEYAMA, MINORU, AKAIWA-GUN, OKAYAMA-KEN 709-08, JP;FUKUTAKE, SUNAO, OKAYAMA-SHI, OKAYAMA-KEN 703, JP;URAKAMI, AKIRA, OKU-GUN, OKAYAMA-KEN 701-42, JP |