| 摘要 |
A semiconductor device is provided that includes a substrate (1) having a first side, a second side and a through-hole (4). An external connection terminal (3) is located on the first side of the substrate (1), and a chip connection terminal (2) is located on the second side of the substrate. The chip connection terminal (2) is electrically connected to the external connection terminal (3) via the through-hole (4). The external connection terminal (3), the inner portion of the through-hole (4) and a first portion of the chip connection terminal (2) have a hard gold plating, and a second portion of the chip connection terminal (2) has a soft gold plating. <IMAGE> |
