| 摘要 |
<p>To dip solder component leads 68, 70 to a printed circuit board 28, the leads are dipped into a bath of solder, and the board rotated about an axis B-B at and angle to the rows of leads 68, 70 as the board is raised form the solder bath. When several components are to be soldered, they may be soldered in turn and the rotation of the board determined for each component. <IMAGE></p> |
