发明名称 |
Semiconductor device and method of manufacturing the same |
摘要 |
Semiconductor device having a semiconductor body (1) whose underside is mounted on a metallic substrate (10) and whose upper side (11) is connected to an additional body (12) which serves as a heat buffer and is composed of a material having high thermal conductivity and which increases its load-carrying capacity for additional thermal load pulses. <IMAGE> |
申请公布号 |
EP0520294(B1) |
申请公布日期 |
1998.08.26 |
申请号 |
EP19920110136 |
申请日期 |
1992.06.16 |
申请人 |
SIEMENS AKTIENGESELLSCHAFT |
发明人 |
KUHNERT, REINHOLD, DR. RER.NAT.;TUERKES, PETER, DR. RER.NAT. |
分类号 |
H01L23/58;H01L23/36;H01L23/373 |
主分类号 |
H01L23/58 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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