发明名称 MOLD FOR RESIN MOLDING
摘要 PROBLEM TO BE SOLVED: To enable a resin molding of high quality by heightening the melting degree of a resin extruded from a pot to be charged in a cavity. SOLUTION: A mold for resin molding is constituted so that a resin melted within a pot 14 is charged in a cavity 18 from the pot 14 through a runner to produce a resin molding. In this case, a pot projection 14a is provided at the peripheral edge part of the pot 14 and a projection 20a is provided on the surface opposed to the pot 14 of a mold 20 opposed to the pot 14 to form the passage of the resin extruded from the pot 14 into a squeezed shape.
申请公布号 JPH10225953(A) 申请公布日期 1998.08.25
申请号 JP19970028820 申请日期 1997.02.13
申请人 APIC YAMADA KK 发明人 HARAYAMA HIROSHI
分类号 B29C45/26;B29C45/02;B29C45/14;B29L31/34;H01L21/56;(IPC1-7):B29C45/02 主分类号 B29C45/26
代理机构 代理人
主权项
地址