| 摘要 |
PROBLEM TO BE SOLVED: To enhance the reliability of the connection of electrodes with leads supported by a tape, by a method wherein one electrode to a plurality of electrodes at both end parts of the long sides of a semiconductor chip is formed into a wide-area electrode or wide-area electrodes of an area wider than that of other electrodes, and at the same time, the connection parts of the leads, which are connected with the wide-area electrodes, are formed into wide- area connection parts of an area wider than that of the connection parts of other leads. SOLUTION: One electrode to a plurality of electrodes at both end parts of the long sides of a semiconductor chip 4 is widened for increasing the connection strength of the one electrode to the plurality of the electrodes at both end parts of the long sides of the chip 4 with leads 3, which are connected with this one electrode to the plurality of these electrodes, in comparison with the connection parts of other leads and at the same time, the connection parts 8 of the leads, which are connected with these wide-area electrodes, are formed into wire-area connection parts of an area wider than that of the connection parts of other leads. Thereby, the connection between the wide-area electrodes and connection reinforcing leads 15 having each wide-area connection part 14 is made at both end parts of the long sides of the slender chip 4. As a result, even if there is a warpage in a tape 2 for supporting the leads 3, the electrodes and the leads 3 result in being connected reliably with each other because a connection strength higher than the force of the warpage is obtained.
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