Plastic molded semiconductor package with thermal dissipation means

摘要

In construction of a plastic molded semiconductor package incorporating a metallic heat sink, the heat sink is made of a thin plate but provided with a central die support depressed from the plane of a surrounding lead support, the section opposite the die support being exposed outside a plastic package. Use of a thin plate as the material enables efficient, continuous processing in production. Presence of the depressed die support assures elongated boundary between the heat sink and the plastic package, thereby effectively reducing undesirable invasion of outer contaminant.