发明名称 |
Method for integrating microelectromechanical devices with electronic circuitry |
摘要 |
A method for integrating one or more microelectromechanical (MEM) devices with electronic circuitry. The method comprises the steps of forming each MEM device within a cavity below a device surface of the substrate; encapsulating the MEM device prior to forming electronic circuitry on the substrate; and releasing the MEM device for operation after fabrication of the electronic circuitry. Planarization of the encapsulated MEM device prior to formation of the electronic circuitry allows the use of standard processing steps for fabrication of the electronic circuitry.
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申请公布号 |
US5798283(A) |
申请公布日期 |
1998.08.25 |
申请号 |
US19950524700 |
申请日期 |
1995.09.06 |
申请人 |
SANDIA CORPORATION |
发明人 |
MONTAGUE, STEPHEN;SMITH, JAMES H.;SNIEGOWSKI, JEFFRY J.;MCWHORTER, PAUL J. |
分类号 |
B81B3/00;B81B7/00;B81B7/02;G03F7/09;G03F7/207;G03F9/00;(IPC1-7):H01L21/00 |
主分类号 |
B81B3/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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