| 摘要 |
PROBLEM TO BE SOLVED: To lessen stress, which is applied by first or second ball connectors which are used for connecting some two out of an integrated circuit chip, an insertion component and a printed circuit board with each other, by a method wherein the first ball connectors are arranged between the printed circuit board and an integrated circuit chip package. SOLUTION: An insertion member 30 is connected with a printed board 50 by the arrangement of first ball connectors 40, which are solder balls, for example. An integrated circuit chip 10 is connected with the member 30 by the arrangement of second ball connectors 20, which are solder balls, for example. The chip 10 can be any type of an integrated circuit chip comprising such the already-known chip as a flip chip or a wire bonding chip. The connectors 20, which connect the chip 10 with the member 30, are arranged on bonding pads on the chip 10, for example. The board 50 is suited for receiving an integrated circuit chip package by the connection of the board 50 with the solder balls. |
